The soldering acid is an active agent specially designed for difficult surfaces, such as nickel-plated ones, where ordinary fluxes are not effective.
Its formula ensures rapid chemical cleaning of the surface, facilitating solder adhesion and the formation of strong connections.
For optimal results, it is recommended to rinse residues with warm deionized water at approximately 50 degrees Celsius,
followed by a rinse with cold water, thus preventing long-term oxidation of the components.
Being a colorless and odorless solution, it is easy to apply precisely
in repair workshops or electronics projects.
Features:
- Quantity: 35 ml
- Cleaning temperature: It is recommended to use deionized water at 50 degrees Celsius to remove residues
- Usage: Recommended for soldering nickel-plated surfaces and difficult materials
- Standards: Complies with ISO 9454 type 3311 and J-STD-004 INM0 standards
- Formula: Active, colorless, and odorless solution
- Effect: Ensures rapid wetting and a strong metallic bond
- Cleaning: Residues are water-soluble
- Efficiency: Viscosity of 19 cP at 20 degrees Celsius